Coating materials for chips represent one of the highest standards in the coating material industry.
High purity sputtering targets are emerging with the development of semiconductor industry. Integrated circuit industry has become one of the main application fields of high purity sputtering targets. With the rapid development of information technology, the requirements of integrated circuits are getting higher and higher. The size of unit devices in the circuit is shrinking, and the size of components is from millimeter level to micron level, and then to nanometer level. Each unit device is composed of substrate, insulating layer, dielectric layer, conductor layer and protective layer. Among them, the dielectric layer, conductor layer and even protective layer all need to use sputtering coating process. Therefore, sputtering target is one of the core materials for preparing integrated circuits. Targets for coating in the field of integrated circuits mainly include aluminum targets, titanium targets, copper targets, tantalum targets, tungsten titanium targets, etc., which require high purity, generally above 5N (99.999%). Therefore, the target material for semiconductor coating is expensive. Semiconductor targets are mainly used in wafer manufacturing and packaging testing.